Anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and method of connecting electronic parts using the same

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United States of America Patent

PATENT NO 11732162
APP PUB NO 20210261829A1
SERIAL NO

16951466

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Abstract

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Disclosed are an anisotropic conductive adhesives for thermo-compression bonding containing solder conductive particles and flux additives and a method of connecting electronic parts using the same. The anisotropic conductive adhesives for thermo-compression bonding may include a flux activator, solder particles and polymer resin.

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Patent Owner(s)

  • KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Paik, KyoungWook Daejeon, KR 4 0
Park, Jae Hyeong Daejon, KR 8 1

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