Molding die for disc substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7101171
APP PUB NO 20030147990A1
SERIAL NO

10311853

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A resin ring 51 is press-fitted into a grove portion formed in an inner periphery surface of an interlocking ring 4. The resin ring 51 is made of a hard resin such as Teflon. The resin ring 51 as a low frictional lubricative member is interposed between the interlock ring 4 and an outer periphery ring 3. In addition, a cavity 6 as a closed space is formed between a stamper 1b as a molding surface of a fixed side mirror 1 and a mirror side molding surface 2b of a moving side mirror 2. While the moving side mirror 2 is being press-contracted to the fixed side mirror 1, when a resin material is filled into the cavity 6, the outer periphery ring 3 is slidably held in a groove of the moving side mirror 2 with predetermined clearances. In the interlock ring 4, a plurality of openings 4a which relieve gas produced by the disc resin material filled into the cavity 6 are formed.

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First Claim

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Patent Owner(s)

  • SONY DISC & DIGITAL SOLUTIONS INC.

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kishi, Shinsuke Shizuoka, JP 10 36
Matsuura, Osamu Shizuoka, JP 44 345
Miura, Kazuhiro Shizuoka, JP 43 299
Yoshimura, Hideaki Shizuoka, JP 56 400

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