Method of manufacturing component embedded printed circuit board

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United States of America Patent

PATENT NO 8683684
SERIAL NO

13200920

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.

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Patent Owner(s)

  • SAMSUNG ELECTRO-MECHANICS CO., LTD.;SAMSUNG ELECTRONICS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cho, Han-Seo Daejeon, KR 20 209
Cho, Suk-Hyeon Suwon-si, KR 14 109
Kim, Byung-Moon Goyang-si, KR 5 10
Yoo, Je-Gwang Yongin-si, KR 46 454

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