Method for attaching a semiconductor die to a support
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United States of America Patent
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Aug 12, 1997
Issued Date -
N/A
app pub date -
Aug 20, 1996
filing date -
Nov 14, 1994
priority date (Note) -
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Abstract
A method for attaching a semiconductor wafer section to a lead free comprises a carrier having an outside surface and an adhesive coating the carrier. Prior to use, the structure can be placed onto spools for easy shipment and storage.
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