Integrated circuit packaging system with dual side connection and method of manufacture thereof
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United States of America Patent
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Jul 9, 2013
Grant Date -
Dec 1, 2011
app pub date -
May 27, 2010
filing date -
May 27, 2010
priority date (Note) -
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Abstract
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; pressing an encapsulation onto the package carrier and with the integrated circuit therein; mounting a conductive frame, having a vertical pillar integral with a horizontal cover, through the encapsulation, over the integrated circuit, and the vertical pillar on the package carrier and the horizontal cover on the encapsulation; and forming a contact from the horizontal cover.
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