Heat sink structure with corrugated wound wire heat conductive elements
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United States of America Patent
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-
Sep 30, 1997
Grant Date -
N/A
app pub date -
Aug 1, 1995
filing date -
Aug 1, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A heat sink structure with a heat-conducting base and wound wire heat conductors thermally attached to the base for use in electronic packaging structures, e.g., those used in computers. The method of making such a structure, as taught herein, provides a unique structure using wire to form the thermally conductive members in a corrugated shape and aligning these with and thermally coupling to a base structure. In one embodiment, the base structure may be excluded with a heat conductive spacer member used instead.
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