Semiconductor device, method of manufacturing three-dimensional stacking type semiconductor device, circuit board, and electronic instrument
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United States of America Patent
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Nov 28, 2006
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N/A
app pub date -
Mar 15, 2004
filing date -
Mar 27, 2003
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Abstract
A semiconductor device has a substrate and an electrode layer formed on the substrate, and the electrode layer includes a plurality of conductive layers and an insulating layer which are stacked, the insulating layer being interposed between two of the conductive layers adjacent each other, a through-hole being formed in each of the conductive layers lower than an uppermost conductive layer among the conductive layers, and the through-hole being filled with an insulating material.
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