Cross-wafer RDLs in constructed wafers
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United States of America Patent
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Feb 20, 2024
Grant Date -
Aug 11, 2022
app pub date -
Apr 25, 2022
filing date -
Jul 2, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A method includes placing a plurality of package components over a carrier, encapsulating the plurality of package components in an encapsulant, forming a light-sensitive dielectric layer over the plurality of package components and the encapsulant, exposing the light-sensitive dielectric layer using a lithography mask, and developing the light-sensitive dielectric layer to form a plurality of openings. Conductive features of the plurality of package components are exposed through the plurality of openings. The method further includes forming redistribution lines extending into the openings. One of the redistribution lines has a length greater than about 26 mm. The redistribution lines, the plurality of package components, the encapsulant in combination form a reconstructed wafer.
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