Integrated circuits having interconnects and heat dissipators based on nanostructures
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United States of America Patent
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Aug 17, 2010
Grant Date -
May 3, 2007
app pub date -
Aug 28, 2006
filing date -
Aug 26, 2005
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Abstract
The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices.
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