Process for preparing a non-conductive substrate for electroplating
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United States of America Patent
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May 8, 2007
Grant Date -
Apr 13, 2006
app pub date -
Oct 13, 2004
filing date -
Oct 13, 2004
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Abstract
A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after desmear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies a sacrificial coating to metallic surfaces on the substrate. The sacrificial coating allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating.
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