Further method to pattern a substrate
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United States of America Patent
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Dec 19, 2006
Grant Date -
Mar 10, 2005
app pub date -
Aug 4, 2004
filing date -
Aug 4, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to methods for patterning substrates, such as reticles, masks or wafers, which reduce critical dimension variations, improving CD uniformity. In particular, it relates to tuning doses applied in passes of a multipass writing strategy to measurable characteristics of resists or radiation sensitive layers applied to the substrates. Particular writing strategies are described. Aspects of the present invention are described in the claims, specification and drawings.
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