Slurry for chemical mechanical polishing

United States of America Patent

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Jun 12, 2007
Grant Date
Feb 5, 2004
app pub date
Jul 11, 2003
filing date
Aug 2, 2002

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Abstract

The present invention relates to a slurry for chemical mechanical polishing, which contains a silica polishing material, an oxidizing agent, a benzotriazole-based compound, a diketone and water.

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Patent Owner(s)

RENESAS ELECTRONICS CORPORATION;TOKYO MAGNETIC PRINTING CO., LTD.;TOPPAN TDK LABEL CO., LTD.

International Classification(s)

C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....

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[Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Aoyagi, Kenichi	Tokyo, JP	87	747
Ito, Tomoyuki	Tokyo, JP	93	781
Sakurai, Shin	Tokyo, JP	18	195
Taiji, Toshiji	Kanagawa, JP	7	37
Tsuchiya, Yasuaki	Kanagawa, JP	37	313

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Slurry for chemical mechanical polishing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

10616914

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PATENT NO	7229570
APP PUB NO	20040021125A1
SERIAL NO	10616914
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 12, 2007	US,7229570,B2 US7229570B2	GRANTED PATENT AS SECOND PUBLICATION
February 05, 2004	US,20040021125,A1 US20040021125A1	FIRST PUBLISHED PATENT APPLICATION

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10616914

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