Method and apparatus for preheating semiconductor chips
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Apr 23, 1991
Grant Date -
N/A
app pub date -
Jan 18, 1990
filing date -
Jul 24, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plurality of semiconductor chips are sequentially mounted on a rotary table, heated on the rotary table for a predetermined time, and ejected from the rotary table. The semiconductor chips ejected from the rotary table are fed to a bonding apparatus. The semiconductor chips are heated while the rotary table is stationary and are held to the rotary table by a vacuum chuck. The position of a semiconductor chip is adjusted before the semiconductor chip is ejected from the rotary table.
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