Semiconductor device package with conductive pillars and reinforcing and encapsulating layers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11521958
APP PUB NO 20210134781A1
SERIAL NO

16675011

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Abstract

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A semiconductor device package includes a redistribution layer, a plurality of conductive pillars, a reinforcing layer and an encapsulant. The conductive pillars are in direct contact with the first redistribution layer. The reinforcing layer surrounds a lateral surface of the conductive pillars. The encapsulant encapsulates the first redistribution layer and the reinforcing layer. The conductive pillars are separated from each other by the reinforcing layer.

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Patent Owner(s)

  • ADVANCED SEMICONDUCTOR ENGINEERING INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Ya Fang Kaohsiung, TW 6 4
Chiang, Yuan-Feng Kaohsiung, TW 16 20

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