Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
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United States of America Patent
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Jan 23, 2007
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N/A
app pub date -
Nov 23, 2004
filing date -
Mar 31, 2004
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Abstract
A semiconductor integrated circuit is so structured that a first insulating layer is formed on a surface of a semiconductor chip and a second insulating layer covers an entire region of the surface of the semiconductor chip. Via apertures made to the second insulating layer, an electrical connection configuration is formed from above the second insulating layer by using gold wires. Then, an electronic component is mounted on the second insulating layer. By arranging as such, the electronic component is mounted on the semiconductor chip in advance. Therefore, it is possible to further reduce mounting space on a printed-wiring board and also possible to make is easy to attain one-packaged IC.
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