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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

• NORTH STAR INNOVATIONS INC.

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Desai, Hemant D	Gilbert , US	19	377
Gogoi, Bishnu P	Scottsdale , US	21	349
Roop, Raymond M	Scottsdale , US	19	370

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
September 08, 2009	US,7585744,B2   US7585744B2	GRANTED PATENT AS SECOND PUBLICATION
June 09, 2005	US,20050124089,A1   US20050124089A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7585744

Method of forming a seal for a semiconductor device

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