Plating apparatus and method of managing plating liquid composition
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United States of America Patent
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-
May 25, 2004
Grant Date -
May 30, 2002
app pub date -
Nov 28, 2001
filing date -
Nov 29, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A plating apparatus comprises a plating unit having a plating bath for holding a plating liquid therein, and a planting monitoring unit having a liquid chromatography device and an arithmetical unit. The liquid chromatography device serves to separate and quantify an additive in a sample of the planting liquid. The arithmetical unit serves to compare a quantified value of the additive with a given concentration predetermined for the additive and to produce an output signal representing the compare result. The plating apparatus further comprises an additive replenishing unit for adding a solution including the additive from an additive tank to the plating liquid in the planting bath based on the output signal from the arithmetical unit in the plating liquid monitoring unit.
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