Signal recognition during substrate patterning via digital photolithography
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United States of America Patent
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Jul 26, 2022
Grant Date -
Mar 25, 2021
app pub date -
Dec 4, 2020
filing date -
Nov 8, 2018
priority date (Note) -
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Abstract
Embodiments of the present disclosure are related to systems and methods for autofocusing an imaging apparatus in real-time during substrate scanning to pattern a substrate that includes a photoresist formed over one or more patterned materials. Displays of varying sizes can be fabricated using digital photolithography systems. The digital photolithography systems discussed herein, which may be referred to as imaging systems, use one or more exposure sources, including solid state emitter devices, for operations including patterning photoresists. Signal classifiers are used to perform shape and pattern recognition to determine whether signals received during substrate scanning are from a top photoresist surface or from sub-surface layers. One or more parameters of the imaging apparatus can be adjusted or maintained based on the signal analysis.
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