Cooling structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9322541
APP PUB NO 20150180099A1
SERIAL NO

14569045

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A cooling structure can efficiently reduce heat, thereby suppressing temperature elevation in heat-producing electronic apparatuses, without using a heat sink or water-cooling jacket, and which can achieve their downsizing or weight reduction. The cooling structure includes: a heat conduction layer which is formed by coating a first paste on a surface of a heat-producing object; and a heat radiation layer which is formed by coating a second paste on a surface of the heat conduction layer. The heat conduction layer includes a first resin and a first filler, and a heat conductivity λ of the heat conduction layer is 1.0 W/(m·K) or more. The heat radiation layer includes a second resin and a second filler, and an infrared emissivity ε of the heat radiation layer is 0.7 or more.

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Patent Owner(s)

  • PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hino, Hirohisa Osaka, JP 20 41
Kishi, Arata Osaka, JP 21 94
Nawa, Honami Osaka, JP 6 6

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