Forming terminations in stacked memory arrays

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United States of America Patent

PATENT NO 11756826
SERIAL NO

17473679

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Abstract

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A termination opening can be formed through the stack alternating dielectrics concurrently with forming contact openings through the stack. A termination structure can be formed in the termination opening. An additional opening can be formed through the termination structure and through the stack between groups of semiconductor structures that pass through the stack. In another example, an opening can be formed through the stack so that a first segment of the opening is between groups of semiconductor structures in a first region of the stack and a second segment of the opening is in a second region of the stack that does not include the groups of semiconductor structures. A material can be formed in the second segment so that the first segment terminates at the material. In some instances, the material can be implanted in the dielectrics in the second region through the second segment.

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Patent Owner(s)

  • MICRON TECHNOLOGY INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chandolu, Anilkumar Boise, US 58 169
Chary, Indra V Boise, US 74 162
Clampitt, Darwin A Wilder, US 77 543
Daycock, David A Boise, US 25 32
George, Thomas Boise, US 64 1581
Haller, Gordon Boise, US 47 700
King, Matthew J Boise, US 57 105
Lowe, Brett D Boise, US 28 168

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