Common heatsink for multiple chips and modules
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United States of America Patent
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Dec 9, 2003
Grant Date -
Jul 10, 2003
app pub date -
Jan 7, 2002
filing date -
Jan 7, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A common heatsink for multiple chips and modules which are spaced on electronic packages, and an arrangement for the formation of precision gaps intermediate two or more chips or modules covered by a common heatsink. Furthermore, a precision tool enables positioning of a common heatsink for multiple chips and modules for electronic packages facilitating the formation of x, y and z-directional compliant thermal interfaces intermediate a plurality of chips and a common heatsink with minimized effects of package tolerances.
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