Method of manufacturing light emitting module

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United States of America Patent

PATENT NO 10892255
SERIAL NO

16454906

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of manufacturing a light emitting module including a substrate; a light emitting element having an electrode formation surface comprising a positive and negative pair of element electrodes, and a light emitting surface on the side opposite to the electrode formation surface; a wiring electrode connected to the element electrode; and a light reflective resin layer, the method of manufacturing a light emitting module including: placing the light emitting element on a support member, in a state with the electrode formation surface facing upward, and the light emitting surface facing downward; forming a coating layer on the support member, surrounding the light emitting element; forming the wiring electrode extending from the element electrode over the coating layer; forming the light reflective resin layer on the wiring electrode and the coating layer; joining the substrate on top of the light reflective resin layer; removing the support member; and removing the coating layer.

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Patent Owner(s)

  • NICHIA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kadan, Katsuyoshi Tokushima, JP 18 179
Nagahama, Yasunori Naruto, JP 6 12
Sakamaki, So Tokushima, JP 7 3
Sano, Masahiko Anan, JP 84 2310

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