Importance

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Abstract

A semiconductor device and method of manufacturing the same, a circuit board and an electronic instrument are such that without substrate material selection or additional steps after connection, connection reliability can be assured, while direct connection to a substrate is possible, further allowing an electronic instrument to be made more compact and lightweight. The semiconductor device comprises a semiconductor chip (100) having electrodes (104), an interconnect layer (120) connected to the electrodes (104), a conducting layer (122) provided on the interconnect layer (120) avoiding the area of the electrodes (104), an underlying metal layer (124) having a size larger than the peripheral outline of the conducting layer (122) provided on the conducting layer (122) and easier to be deformed than the conducting layer (122), bumps (200) provided on the underlying metal layer (124), and a resin layer (126) provided on the periphery of the conducting layer (122).

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First Claim