Assembly of a chip to a substrate

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United States of America Patent

PATENT NO 11824037
SERIAL NO

17139298

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Abstract

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An exemplary method includes at a bonding temperature, bonding a semiconductor chip to an organic laminate substrate using solder; without cooldown from the bonding temperature to room temperature, at an underfill dispense temperature, dispensing underfill between the semiconductor chip and the organic laminate substrate; and curing the underfill within a range of temperatures above the underfill dispense temperature. Another exemplary method includes depositing a first solder on pads of an organic laminate substrate; contacting a second solder on pillars of a semiconductor chip to the first solder on the pads of the organic laminate substrate; and solder bonding the semiconductor chip to the organic laminate substrate.

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Patent Owner(s)

Patent OwnerAddress
INTERNATIONAL BUSINESS MACHINES CORPORATIONNEW ORCHARD ROAD ARMONK NY 10504

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Andry, Paul S Yorktown Heights, US 122 1850
Farooq, Mukta Ghate Hopewell Jct, US 39 103
Kastberg, Russell Modena, US 2 0
Sakuma, Katsuyuki Fishkill, US 86 307

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