Laminated electronic component and method for producing the same
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United States of America Patent
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Nov 4, 2008
Grant Date -
Feb 1, 2007
app pub date -
Jan 6, 2005
filing date -
Jan 27, 2004
priority date (Note) -
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Abstract
A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet includes a thermosetting resin in a semi-cured state and is compression bonded on the principal surface of the ceramic substrate so as to cover the first groove. The resin sheet is then cured by heating. Thus, a combined laminate is produced. When the resin sheet is compression bonded, air trapped in the interface with the ceramic substrate is discharged outside through the first groove. The combined laminate is divided into separate pieces along the first groove. An outer terminal electrode is formed on the outer surface of a resin layer of the resultant separate piece.
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