Semiconductor integrated circuit and semiconductor device having multilayer interconnection
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United States of America Patent
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Mar 23, 2010
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N/A
app pub date -
Dec 19, 2006
filing date -
Dec 21, 2005
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Abstract
A semiconductor device includes: multi-layer interconnection substrate having signal distribution interconnection and power supply line; and semiconductor circuit blocks installed on the multi-layer interconnection substrate for performing required operations. The multi-layer substrate includes: a third interconnection layer having interconnections extending in a first direction; a second interconnection layer having interconnections extending in a second direction which is different to the first direction; and a first interconnection layer having interconnections extends in a direction orthogonal to the first direction.
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