Methods and apparatus for thinner package on package structures
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United States of America Patent
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May 9, 2017
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N/A
app pub date -
May 4, 2015
filing date -
Jan 13, 2012
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Abstract
Methods and apparatus for thinner package on package (“PoP”) structures. A structure includes a first integrated circuit package including at least one integrated circuit device mounted on a first substrate and a plurality of package on package connectors extending from a bottom surface; and a second integrated circuit package including at least another integrated circuit device mounted on a second substrate and a plurality of lands on an upper surface coupled to the plurality of package on package connectors, and a plurality of external connectors extending from a bottom surface; wherein at least the second substrate is formed of a plurality of layers of laminated dielectric and conductors. In another embodiment a cavity is formed on the bottom surface of the first substrate and a portion of the another integrated circuit extends partially into the cavity. Methods for making the PoP structures are disclosed.
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