Manufacturing method of a piezoelectric element and a liquid ejecting head
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United States of America Patent
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Sep 2, 2014
Grant Date -
Feb 9, 2012
app pub date -
Aug 3, 2011
filing date -
Aug 4, 2010
priority date (Note) -
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status (Latency Note)
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Abstract
A manufacturing method of a piezoelectric element includes: forming a first conductive layer upon a substrate; forming a piezoelectric layer upon the first conductive layer; forming a second conductive layer upon the piezoelectric layer; forming a third conductive layer upon the second conductive layer; forming a first portion, a second portion, and an opening portion provided between the first portion and the second portion by patterning the third conductive layer; forming a resist layer that covers the opening portion and covers the edges of the first portion and the second portion that face the opening portion side; and forming a first conductive portion and a second conductive portion configured from the first portion and the second portion, and forming a third conductive portion configured from the second conductive layer, by dry-etching the second conductive layer using the first portion, the second portion, and the resist layer as a mask.
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