Process of fabricating semiconductor packages using leadframes roughened with chemical etchant
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United States of America Patent
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Apr 17, 2007
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app pub date -
Jul 16, 2004
filing date -
Jul 19, 2003
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Abstract
A semiconductor package contains a metal leadframe that has been specially treated by roughening it with a chemical etchant. The roughening process enhances the adhesion between the leadframe and the molten plastic during the encapsulation of the leadframe and thereby reduces the tendency of the package to separate when exposed to moisture and numerous temperature cycles. In one embodiment, the leadframe made of copper is roughened with a chemical etchant that contains sulfuric acid and hydrogen peroxide.
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