Method and apparatus for failure prediction of an electronic assembly using life consumption and environmental monitoring
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United States of America Patent
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Jan 6, 2009
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N/A
app pub date -
Mar 17, 2005
filing date -
Mar 17, 2005
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Abstract
Presently disclosed are a method and apparatus for predicting a failure in an electronic assembly by detecting an incremental change exhibited by a sacrificial sensor that is integrated into the electronic assembly and by monitoring environmental conditions that the electronic assembly is exposed to. A failure prediction is that made according to the detected incremental change exhibited by the sacrificial sensor and according to the monitored environmental conditions.
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