Aligner, wafer transferring device, and semiconductor production device
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United States of America Patent
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Jun 14, 2011
Grant Date -
Apr 24, 2008
app pub date -
Oct 17, 2007
filing date -
Oct 19, 2006
priority date (Note) -
In Force
status (Latency Note)
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Abstract
In a preferred embodiment, an aligner includes a grip mechanism provided with a plurality of damp arms for holding an external periphery of a wafer; a rotary mechanism for rotating the grip mechanism to rotate the wafer in a prescribed rotational direction, and a lifter mechanism provided with a plurality of lift arms for lifting up the wafer above the grip mechanism. The aligner is configured to align the wafer by the grip operation of the grip mechanism and the rotary operation of the rotary mechanism, and one or more of the plurality of the lift arms which interfere with one or more of the plurality of clamp arms at the time of lifting up the plurality of lift arms are engaged with restriction members provided on the grip mechanism to prevent an upward movement thereof.
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