Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
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United States of America Patent
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Apr 6, 2010
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app pub date -
Jul 5, 2005
filing date -
Jul 8, 2004
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Abstract
A reliable semiconductor device including support bumps so as to adequately seal the region between the chips is to be provided. The semiconductor device includes a semiconductor chip; a bump formed on an upper face of the semiconductor chip; and a plurality of support bumps formed along a circumference of the region where the bump is provided, formed on the upper face of the semiconductor chip; and a flow path for a sealing resin is provided between the plurality of support bumps, so as to connect the region where the bump is provided and a periphery region of the semiconductor chip.
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