Method of double floating transport and processing of wafers within a confined passageway
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United States of America Patent
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May 5, 1987
Grant Date -
N/A
app pub date -
Mar 25, 1986
filing date -
Aug 1, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Method of transporting and processing of substrates, including wafers of the type used for semiconductors. Particularly, a method of flowing fluid medium longitudinally within a confined passageway so that the substrate is supported, transported and processed in a double floating condition without touching the walls of the passageway. The method is characterized by the restricting of flowing of fluid medium into the passageway, so as to guide the substrate during transport and processing by injecting pressurized coating medium into the passageway at a series of processing stations defined intermediate transport sections of said passageway.
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