Semiconductor package having symmetrically arranged power terminals and method for producing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11004764
SERIAL NO

16519802

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Abstract

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A double-sided coolable semiconductor package includes an upper electrically conductive element having an outwardly exposed metal surface, a lower carrier substrate having an upper electrically conductive layer, a lower electrically conductive layer having an outwardly exposed surface, and an electrical insulation layer arranged between the electrically conductive layers, a first electrically conductive spacer arranged between the upper electrically conductive element and the upper electrically conductive layer, a power semiconductor chip arranged between the upper electrically conductive element and the upper electrically conductive layer, a second electrically conductive spacer arranged between the upper electrically conductive element and the chip, and power terminals arranged along a first side of the package. A second power terminal is arranged between first and third power terminals. The first and third power terminals are configured to apply a first supply voltage. The second power terminal is configured to apply a second supply voltage.

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Patent Owner(s)

  • INFINEON TECHNOLOGIES AG

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hoegerl, Juergen Regensburg, DE 80 476
Hong, Tao Soest, DE 124 1487
Karczewski, Tino Sinzing, DE 3 4
Lassmann, Matthias Lippstadt, DE 2 2
Schweikert, Christian Munich, DE 12 50

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