Resonant LC tank package and method of manufacture
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United States of America Patent
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Dec 6, 2022
Grant Date -
N/A
app pub date -
Dec 15, 2020
filing date -
Mar 2, 2018
priority date (Note) -
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Abstract
A package on a die having a low resistive substrate, wherein the package comprises an inductor on low-k dielectric and a capacitor on high-k dielectric. The stacked arrangement having different dielectric materials may provide an inductor having a high Q-factor while still having a high capacitance density. In addition, moving the inductor from the die to the package and fabricating the high density capacitor on the package reduces the silicon area required permitting smaller RF/analog blocks on the chip.
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