Method for affixing adhesive tape to semiconductor wafer, and apparatus using the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 14, 2010
Grant Date -
Aug 23, 2007
app pub date -
Feb 2, 2007
filing date -
Feb 22, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In association with movement of an affixation roller, a movement position of the affixation roller is detected by a rotation sensor based on a rotation amount of a motor. A control device changes and controls an amount of an adhesive tape to be fed forcibly based on a result of the detection, and keeps a tensile force applied to the adhesive tape in the affixation of the adhesive tape to the semiconductor wafer within a preset range.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully