Negative photoresist compositions for the formation of thick films, photoresist films and methods of forming bumps using the same
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United States of America Patent
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Oct 31, 2006
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N/A
app pub date -
Oct 26, 2005
filing date -
May 21, 2001
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Abstract
A negative photoresist composition is used for the formation of thick films and includes (A) a novolak resin, (B) a plasticizer, (C) a crosslinking agent and (D) an acid generator. The composition is applied onto a substrate and thereby yields a photoresist film 5 to 100 .mu.m thick. Likewise, the composition is applied onto a substrate of an electronic part, is patterned, is plated and thereby yields a bump.
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