Integrated fan-out package-on-package testing
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United States of America Patent
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Aug 16, 2016
Grant Date -
Jul 2, 2015
app pub date -
Dec 27, 2013
filing date -
Dec 27, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A device for testing a bottom package of an integrated fan-out (InFO) Package-on-Package (PoP) comprises a bottom fixture having a space to accommodate the bottom package during testing and a detachable top cover, configured for conducting at least one test of the bottom package, wherein one or both of the bottom fixture and the top cover have a plurality of probing contacts for testing of the bottom package and wherein the device can be opened for placement of the bottom package under testing, and the cover is attachable to the bottom fixture for conducting the testing.
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