Negative imaging method for providing a patterned metal layer having high conductivity
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United States of America Patent
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Feb 23, 2010
Grant Date -
Apr 23, 2009
app pub date -
Oct 23, 2007
filing date -
Oct 23, 2007
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Abstract
Disclosed is a method negative imaging method for making a metal pattern with high conductivity comprising providing a patterned substrate comprising a patterned catalyst layer on a base substrate by a thermal imaging method followed by plating to provide the metal pattern. The metal patterns provided are suitable for electrical devices including electromagnetic interference shielding devices and touchpad sensors.
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