Method and apparatus for manufacturing semiconductor wafers and cutting wire apparatus for use therein
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United States of America Patent
Stats
-
Nov 6, 1990
Grant Date -
N/A
app pub date -
Feb 16, 1989
filing date -
Feb 17, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Wafers are manufactured from an ingot of semiconductor material by first machining a front face of the ingot to provide a substantially planar reference surface and then slicing the ingot using looped cutting wire apparatus. The cutting wire apparatus includes a looped cutting wire and at least two drive rollers over sectors of which the cutting wire is wrapped. Each drive roller is provided with its own drive motor which has shunt motor characteristics. The speed and torque of each motor is adjustable relative to the load applied to its drive roller by the cutting wire such that all of the drive rollers participate in driving the cutting wire with substantially the same reliability against slippage so that wear is distributed uniformly over all of the drive rollers.
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