Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same
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United States of America Patent
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Nov 10, 2015
Grant Date -
Jun 26, 2014
app pub date -
Mar 15, 2013
filing date -
Dec 25, 2012
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Abstract
A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.
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