Micro-molded fluid pressure sensor housing
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United States of America Patent
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Apr 18, 2023
Grant Date -
Nov 25, 2021
app pub date -
Aug 4, 2021
filing date -
Jun 21, 2019
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A micro pressure sensor includes a sense die mounted on a substrate, a ring structure encircling the sense die, and a silicone material is overmolded to an exterior of the ring structure to form a seal with the ring structure and fills an interior of the ring structure. The ring structure has one or more legs at bottom side, which are snap fitted to the substrate through mating holes such that the ring structure encircles the sense die; and a top surface of the silicone material receives the external pressure and transmits the external pressure to the sense surface of the sense die to generate an output signal on the sense die, wherein a processor converts the output signal into a pressure reading. The pressure-transmitting media transmits a received external pressure to the sense surface of the sense die to generate an output signal from the sense die, wherein a processor converts the output signal into a pressure reading.
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