Method for forming inductor in semiconductor device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6991992
APP PUB NO 20050037589A1
SERIAL NO

10876728

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a method for manufacturing an inductor being a passive device in RE MEMS, RFCMOS, Bipolor/SiGe and BiCMOS semiconductor devices. According to the present invention, a first negative photoresist layer is covered on a substrate having a lower electrode. A via hole that will become a contact portion of the inductor is then defined by means of an exposure process using a first mask. A second negative photoresist layer is covered on the first negative photoresist layer. Trenches that will become line portions of the inductor are defined by an exposure process using a second mask. A damascene pattern having the via hole and the trenches is formed by means of a developing process and is then buried with copper, thus forming the inductor. Not only a thickness of the trenches in the line portion and a thickness of the via hole in the contact portion can be uniformly controlled, but also their height can be easily controlled. Therefore, that an inductor of a high quality can be manufactured.

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Patent Owner(s)

  • CHUNG CHENG HOLDINGS, LLC

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kim, Young Keun Cheongju-Shi, KR 86 583

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