Compositions for preparing low dielectric materials
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United States of America Patent
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Oct 17, 2006
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app pub date -
May 20, 2003
filing date -
May 30, 2002
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Abstract
Low dielectric materials and films comprising same have been identified for improved performance when used as performance materials, for example, in interlevel dielectrics integrated circuits as well as methods for making same. In one aspect of the present invention, the performance of the dielectric material may be improved by controlling the weight percentage of ethylene oxide groups in the at least one porogen.
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