Power delivery for multi-chip-package using in-package voltage regulator

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United States of America Patent

PATENT NO 11671010
APP PUB NO 20210249952A1
SERIAL NO

16991335

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor structure includes a first substrate. A first die and a second die are disposed over the first substrate and are adjacent to one another. A plurality of first conductive bumps are disposed between the first substrate and the first die and between the first substrate and the second die. A second substrate is disposed below the first substrate. A plurality of second conductive bumps is disposed between the first substrate and the second substrate. An in-package voltage regulator (PVR) chip is disposed over the second substrate. A molding material is disposed over the first substrate and surrounds the first die, the second die, the plurality of first conductive bumps, the plurality of second conductive bumps, and the PVR chip.

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Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsu, Ying-Chih Hsin-Chu, TW 22 98
Huang, Tze-Chiang Saratoga, US 43 65
Ranucci, Paul Leander, US 15 53
Roth, Alan Leander, US 106 848
Soenen, Eric Austin, US 104 660
Wong, Mei Hsu Saratoga, US 11 4
Zhou, Haohua Fremont, US 16 8

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