Variable cross-section plated mushroom with stud for bumping
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United States of America Patent
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-
Sep 6, 2005
Grant Date -
Sep 9, 2004
app pub date -
Mar 19, 2004
filing date -
Jan 9, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
An improved bump fabrication process is described that produces a larger diameter/taller solder ball than with a standard mushroom by forming an elongated mushroom having a short axis in the direction of adjacent connection mushrooms and an elongated axis orthogonal to the short axis. The increased larger volume solder when reflowed produces the larger diameter/taller bolder ball bump.
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