Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package
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United States of America Patent
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Feb 22, 2011
Issued Date -
N/A
app pub date -
Jul 31, 2007
filing date -
Aug 1, 2006
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An image sensor package, a method of manufacturing the same, and an image sensor module including the image sensor package are provided. In the image sensor package, an image sensor chip is installed onto a depression of a transmissive substrate. An adhesive bonds the image sensor chip to the transmissive substrate and seals an Active Pixel Sensor (APS) on the image sensor chip, protecting it from fine particle contamination. An IR cutting film is disposed on the transmissive substrate to minimize the height of the image sensor package. The image sensor package is electrically connected to external connection pads in the depression. Consequently, the image sensor package has a minimum height, is not susceptible to particle contamination, and does not require expensive alignment processes during manufacturing.
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