Diamondoid-containing materials for passivating layers in integrated circuit devices
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United States of America Patent
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Sep 25, 2007
Grant Date -
Dec 16, 2004
app pub date -
Jul 14, 2004
filing date -
Jan 19, 2001
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Novel uses of diamondoid-containing materials in the field of microelectronics are disclosed. Embodiments include, but are not limited to, passivation films for integrated circuit devices (ICs). The diamondoids employed in the present invention may be selected from lower diamondoids, as well as the newly provided higher diamondoids, including substituted and unsubstituted diamondoids. The higher diamondoids include tetramantane, pentamantane, hexamantane, heptamantane, octamantane, nonamantane, decamantane, and undecamantane. The diamondoid-containing material may be fabricated as a diamondoid-containing polymer, a diamondoid-containing sintered ceramic, a diamondoid ceramic composite, a CVD diamondoid film, a self-assembled diamondoid film, and a diamondoid-fullerene composite.
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