Printed circuit board and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11439019
APP PUB NO 20200107447A1
SERIAL NO

16584952

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A printed circuit board includes a printed wiring board, a semiconductor element, and conductive members. The printed wiring board includes an insulative substrate having a first surface and a second surface opposite to the first surface, and wiring provided on the second surface of the insulative substrate to face the through-holes. The insulative substrate has flexibility and through-holes passing through the insulative substrate from the first surface to the second surface. The semiconductor element is mounted on the first surface of the insulative substrate of the printed wiring board and has element terminals interposed between the printed wiring board and the semiconductor element. The conductive members filled in the through-holes connect the element terminals and the wiring.

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Patent Owner(s)

  • NICHIA CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katsumata, Masaaki Anan, JP 72 460
Kishimoto, Tomohisa Anan, JP 36 349
Sakamoto, Masakazu Tokushima, JP 83 820

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