System and method for laser assisted bonding of an electronic device

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United States of America Patent

PATENT NO 11742216
APP PUB NO 20210082717A1
SERIAL NO

17005021

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Abstract

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A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

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Patent Owner(s)

  • AMKOR TECHNOLOGY SINGAPORE HOLDING PTE LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jung, Yang Gyoo Seoul, KR 9 37
Kim, Choong Hoe Seoul, KR 10 33
Kim, Min Ho Seoul, KR 108 689
Ryu, Dong Soo Seongnam-si, KR 9 76
Song, Youn Seok Gwangju, KR 6 24
Yoon, Tae Ho Daejeon, KR 21 658

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